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lite-on dcc release lite-on technology corp. / optoelectronics no.90,chien 1 road, chung ho, new taipei city 23585, taiwan, r.o.c. tel: 886-2-2222-6181 fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto through hole lamp product data sheetLTW-2W3DRASP1 spec no.: ds20-2013-0148effective date: 06/23/2015revision: a bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4
1 / 10 part no. : lt w - 2w3dr as p1 bns - od - fc0 0 2/a4 through hole lamp ltw - 2w3dras p1 through hole lamp ltw - 2w3dras p1 rev description by date above data for pd and customer tracking only - nppr received and upload on opnc javy huang 0 7 / 05 /2013 a update iv spec ification and ds format javy huang 06/02/ 2 015
2 / 10 part no. : lt w - 2w3dr as p1 bns - od - fc0 0 2/a4 through hole lamp ltw - 2w3dras p1 1. description through - hole white leds are offered in a variety of packages such as 3mm, 4mm, 5mm, rectangular and cylinder which are suitable for all applications requiring status indication. several intensity and viewing a ngle choices are available in each package for design flexibility. 1 . 1. features ? lead (pb) free product - rohs compliant ? low power consumption & high efficiency . ? versatile mounting on p.c. board or panel. ? i.c. compatible/low current requirement. ? t - 1 3/4 d iameter ingan white & water clear lens 1.2 . applications ? computer ? communication ? consumer ? home appliance ? industrial 2 . outline dimensions notes : 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25mm (.010") unless otherwise noted. 3. protr uded resin under flange is 1.0mm(.04") max. 4. lead spacing is measured where the leads emerge from the package. 5. specifications are subject to change without notice.
3 / 10 part no. : lt w - 2w3dr as p1 bns - od - fc0 0 2/a4 through hole lamp ltw - 2w3dras p1 3 . absolute maximum ratings at ta=25 parameter maximum rating unit power dissipation 1 08 m w peak forward current (duty cycle Q 1/10, pulse width Q 10ms) 100 ma dc forward current 30 ma der ating linear from 3 0 0. 5 ma/ operating temperature range - 4 0c to + 85c storage temperature range - 40c to + 100c lead soldering temperature [2.0mm (.07 9") from body] 260c for 5 seconds max. 4. electrical / optical characteristics at ta=25 parameter symbol min. typ. max. unit test condition luminous intensity iv 1750 2530 3540 if = 20ma note 1 ,3 , 4 iv spec. table viewing angle 21/2 10 0 deg note 2 chromaticity coordinates x 0. 3 1 if = 20ma note 5 hue spec. table & chromaticity diagram y 0. 32 forward voltage vf 2.6 3.2 3.6 v if = 20ma reverse current ir 10 a vr = 5v , note 6 note: 1. luminous intensity is measured with a light sensor and filter combination that approximates the cie eye - response curve. 2. 1/2 is the off - axis angle at which the luminous intensity is half the axial luminous intensity. 3. iv classification code is marked on each packing bag. 4. the iv guarantee should b e added 15% tolerance. 5. the chromaticity coordinates (x, y) is derived from the 1931 cie chromaticity diagram. 6. reverse voltage (v r ) condition is applied for ir test only. the device is not designed for reverse operation .
4 / 10 part no. : lt w - 2w3dr as p1 bns - od - fc0 0 2/a4 through hole lamp ltw - 2w3dras p1 5. typical electrical / opti cal characteristics curves (25 ambient temperature unless otherwise noted)
5 / 10 part no. : lt w - 2w3dr as p1 bns - od - fc0 0 2/a4 through hole lamp ltw - 2w3dras p1 6. packing spec. 500, 200 or 100 pcs per packing bag 10 packing bags per inner carton t otal 5,0 00 pcs per inner carton 8 inner cartons per outer carton t otal 4 0 ,000 pcs per outer carton in every shipping lot, only the last pack will be non - full packing
6 / 10 part no. : lt w - 2w3dr as p1 bns - od - fc0 0 2/a4 through hole lamp ltw - 2w3dras p1 7. bin table specification 7.1. optical/electrical bin table for reference luminous intensity , unit: mcd , i f= 2 0ma iv bin code min. max. r1 1750 2530 s1 2530 3540 note: tolerance of each bin l imit is 15% hue ranks chromaticity coordinates, cc(x,y), if=2 0ma a0 x 0.28 0 0.264 0.283 0.296 y 0.248 0.267 0.305 0.276 b1 x 0.283 0.287 0.33 0 0.33 0 y 0.305 0.295 0.339 0.36 0 b2 x 0.296 0.287 0.33 0 0.33 0 y 0.276 0.295 0.339 0.318 c0 x 0.33 0 0.3 61 0.356 0.33 0 y 0.36 0 0.385 0.351 0.318 note: tolerance of each bin limit is 0.01
7 / 10 part no. : lt w - 2w3dr as p1 bns - od - fc0 0 2/a4 through hole lamp ltw - 2w3dras p1 c.i.e. 1931 chromaticity diagram c0 b1 b2 a0 0.20 0.25 0.30 0.35 0.40 0.45 0.20 0.25 0.30 0.35 0.40 0.45 (x) (y) c0 b1 b2 a0 a1
8 / 10 part no. : lt w - 2w3dr as p1 bns - od - fc0 0 2/a4 through hole lamp ltw - 2w3dras p1 8 . cautions 8.1 . application this led lamp is good for application of indoor and outdoor sign, also ordinary electronic equipment . 8.2 . storage the storage ambient for the leds should not exceed 30c temperature or 70% relative humidity. it is recommended that leds out of their original packaging are used within three months. for extended storage out of their original packaging, it is recommended that the leds be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient. 8 . 3. cleaning use alcohol - based cleaning solvents such as isopropyl alcohol to clean the leds if necessary. 8 . 4. lead formin g & assembly during lead forming, the leads should be bent at a point at least 3mm from the base of led lens. do not use the base of the lead frame as a fulcrum during forming. lead forming must be done before soldering, at normal temperature. during asse mbly on pcb, use minimum clinch force possible to avoid excessive mechanical stress. 8 . 5. soldering when soldering, leave a minimum of 2 mm clearance from the base of the lens to t he soldering point. dipping the lens into the solder must be avoided. do not apply any external stress to the lead frame during sol dering while the led is at high temperature. r ecommended soldering conditions : soldering iron wave soldering temperature soldering time position 350c max. 3 seconds max. (one time only) no closer than 2 mm from the base of the epoxy bulb pre - heat pre - heat time solder wave soldering time dipping position 1 0 0c max. 60 seconds max. 260c max. 5 seconds max. no lower than 2 mm from the base of the epoxy bulb note: excessive sol dering temperature and/or time might result in deformation of the led lens or catastrophic failure of the led. ir reflow is not suitable process for through - hole type led lamp product . 8 . 6. drive method an led is a current - operated device. in order to en sure intensity uniformity on multiple leds connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each led as shown in circuit a below. circuit model ( a ) circuit model ( b ) (a) recommended circuit (b) the brightness of each led might appear different due to the differences in the i - v characteristics of those leds. led led
9 / 10 part no. : lt w - 2w3dr as p1 bns - od - fc0 0 2/a4 through hole lamp ltw - 2w3dras p1 8 .7. esd (electrostatic discharge) static electricity or power surge will damage the led. suggestions to prevent esd damage: ? use a conductive wrist band or anti - electrostatic glove when handling these leds ? all devices, equipment, and machinery must be properl y grounded ? work tables, storage racks, etc. should be properly grounded ? use ion blower to neutralize the static charge which might have built up on surface of the leds plastic lens as a result of friction between leds during storage and handing suggested c hecking list : training and certification 8 .7. 1 .1 . everyone working in a static - safe area is esd - certified? 8 .7.1. 2. training records kept and re - certification dates monitored? static - safe workstation & work areas 8 .7.2.1 . static - safe workstatio n or work - areas have esd signs? 8 .7. 2. 2. all surfaces and objects at all static - safe workstation and within 1 ft measure less than 100v? 8 .7.2. 3. all ionizer activated, positioned towards the units? 8 .7.2. 4. each work surface mats grounding is good? personnel grounding 8 .7.3.1 . every person (including visitors) handling esd sensitive (esds) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 8 .7.3.1 . if conductive footwear used, conductive flooring also prese nt where operator stand or walk? 8 .7.3.2 . garments, hairs or anything closer than 1 ft to esd items measure less than 100v*? 8 .7.3.3 . every wrist strap or heel strap/conductive shoes checked daily and result recorded for all dls? 8 .7.3.4 . al l wrist strap or heel strap checkers calibration up to date? note: *50v for blue led. device handling 8 .7.4. 1. every esds items identified by eia - 471 labels on item or packaging? 8 .7.4. 2. all esds items completely inside properly clos ed static - shielding containers when not at static - safe workstation? 8 .7.4. 3. no static charge generators (e.g. plastics) inside shielding containers with esds items? 8 .7.4. 4. all flexible conductive and dissipative package materials inspected bef ore reuse or recycle? others 8 .7.5. 1. audit result reported to entity esd control coordinator? 8 .7.5. 2. corrective action from previous audits completed? 8 .7.5. 3. are audit records complete and on file?
10 / 10 part no. : lt w - 2w3dr as p1 bns - od - fc0 0 2/a4 through hole lamp ltw - 2w3dras p1 9 . reliability test classification tes t item test condition sample size reference standard endurance test operation life ta = under room temperature per data sheet maximum rating test time= 1000hrs 22 pcs (cl=90%; ltpd= 10 %) mil - std - 750d:1026 (1995) mil - std - 883g:1005 (2006) high temperatur e high humidity storage (thb) ta = 60 c rh = 90 % test time= 1000hrs 22 pcs (cl=90%; ltpd= 10 %) mil - std - 202g:103b (2002) jeita ed - 4701:100 103 (2001) high temperature storage ta= 105 5 c test time= 1000hrs 22 pcs (cl=90%; ltpd= 10 %) mil - std - 750d:1031 ( 1995) mil - std - 883g:1008 (2006) jeita ed - 4701:200 201 (2001) low temperature storage ta= - 55 5 c test time= 1000hrs 22 pcs (cl=90%; ltpd= 10 %) jeita ed - 4701:200 202 (2001) environmental test temperature cycling 100 c 25 c - 40 c 25 c 30mins 5mins 30mins 5mins test time: 30 cycles 22 pcs (cl=90%; ltpd= 10 %) mil - std - 750d:1051 (1995) mil - std - 883g:1010 (2006) jeita ed - 4701:100 105 (2001) jesd22 - a104c (2005) thermal shock 100 5 c - 30 c 5 c 15mins 15mins test time: 3 0 cycles 22 pcs (cl=90%; ltpd= 10 %) mil - std - 750d:1056 (1995) mil - std - 883g:1011 (2006) mil - std - 202g:107g (2002) jesd22 - a106b (2004) solder resistance t.sol = 260 5 c dwell time= 101 seconds 3mm from the base of the epox y bulb 11 pcs (cl=90%; ltpd=18.9%) mil - std - 750d:2031(1995) jeita ed - 4701: 300 302 (2001) solderability t. sol = 245 5 c dwell time= 5 0.5 seconds (lead free solder, coverage R 95% of the dipped surface) 11 pcs (cl=90%; ltpd=18.9%) mil - std - 750d:2026 (1995) mil - std - 883g:2003 (2006) mil - std - 202g:208h (2002) ipc/eia j - std - 002 (2004) soldering iron t. sol = 350 5 c dwell time= 3.5 0.5 seconds 11 pcs (cl=90%; ltpd=18.9%) mil - std - 202g:208h (2002) jeita ed - 4701:300 302 (2001) 1 0 . others white led is materialized by combining blue led and phosphors. color of white led is changed a little by an operating current. the appearance and specifications of the product may be modified for improvement, without prior notice.

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